Figure 6: AFM imaging of a n-hexene modified partition surface where a triangular area in the lower right corner has been shielded during plasma treatment leaving an unmodified ETFE surface. A): Topographic map. B): Force-distance curves for untreated (black) and n-hexene modified (red) partition surface interacting with a hydrophobic (hexadecane coated) AFM tip. Solid lines represent approach while dashed lines represent retraction. C): 50×50 pixel force volume (FV) map generated from force-distance curves (B) for each pixel for the area shown in A. For the untreated surface area the average adhesion energy Wad = 665±152 aJ (average of 251 FV measurements), while for the n-hexene modified surface Wad = 345±90 aJ (average of 902 FV measurements). For the silicon wafer (natural oxide layer) mounting surface Wad = 122±21 aJ (average of 100 FV measurements).