Materials Type Composition Manufacturer Tetric N-Bond Etch-and-rinse adhesive HEMA, Bis GMA, urethane dimethacrylates, phosphonic acid acrylate, Ethanol(< 20% wt), nano-filler(Sio2) (< 1%wt),     film-forming agent, Catalysts and stabilizers IvoclarVivadent, Schaan, Liechtenstein AdheSE Two-step self-etch adhesive Primer: dimethacrylate, phosphonic acid acrylate, initiators and stabilizers in an aqueous solution. Bonding: HEMA, dimethacrylate, silicon dioxide, initiators and stabilizers. IvoclarVivadent, Schaan, Liechtenstein AdheSE One F Self-etch adhesive Derivates of bis-acrylamide, water, bis-methacrylamidedihydrogen phosphate, alcohol, amino acid acrylamide, hydroxy alkyl methacrylamid, alkyl sulforic acid acrylamide, highly dispersed silicon dioxide, initiators, stabilizers and potassium fluoride IvoclarVivadent, Schaan, Liechtenstein Single Bond 2 Etch-and-rinse adhesive BisGMA, HEMA, dimethacrylates, ethanol, water, a novel photoinitiator system and a methacrylate functional copolymer of polyacrylic and polyitaconic acids 3M, ESPE, St.Paul, MN, USA SE Bond self etch adhesive Primer: MDP, HEMA, hydrophilic dimethacrylates, N,N-diethanol p-toluidine, CQ, water Band: MDP, HEMA, Bis-GMA, hydrophobic dimethacrylates, silanated colloidal silica, N,N-diethanol p-toluidine, CQ Kuraray, Tokyo, Japan Adper Prompt L-Pop self etch adhesive Liquid 1: Methacrylated phosphoric esters Bis-GMA, Initiators based on camphorquinone Stabilizers Liquid 2: Water, 2-Hydroxyethyl methacrylate (HEMA), Polyalkenoic acid, Stabilizers 3M, ESPE, St.Paul, MN, USA Z 250 Light cure composite Bis-GMA, UDMA andBis-EMA; • 66% of filler: Zirconium/ Silica 3M, ESPE, St.Paul, MN, USA N-Etch etchant 37%Phosphoric acid , thickeners and pigments IvoclarVivadent, Schaan, Liechtenstein

Table1: Materials used in this study