Material Chemical composition Application protocol Batch Number
Filtek Z250
(3M ESPE, Seefeld, Germany)
Bis-GMA, UDMA, Bis-EMA
Zr/Si filler
Light cure (20 s) A2: 7YL
A4: 8TP
Optibond FL (OPF)
(Kerr, Orange, USA)
Kerr Gel Etchant: 37.5% H3PO4
Primer: HEMA, GPDM, PAMM, water, ethanol, camphorquinone
Adhesive: Bis-GMA, HEMA, GDMA, camphorquinone, inert mineral fillers
Kerr Gel Etchant: etch (15 s), rinse (15 s), gently air dry
Primer: apply and rub (15 s), gently air dry (5 s)
Adhesive: apply a thin coat and gently air dry, light cure (20 s)
Kerr Gel Etchant:2891204
Primer: 2742088
Adhesive: 2782642
Gluma Comfort Bond (GLU)
(Heraeus, Hanau, Germany)
Gluma Etch 20 Gel: 20% H3PO4
Bond: UDMA, HEMA, 4-META, Poly (methacrylic-oligo-acrylic acid), ethanol, water, photoinitiators, stabilizers
Gluma Etch 20 Gel: etch (20 s), rinse (15 s), gently air dry (1-2 s)
Bond: apply three coats, wait (15 s), gently air dry, light cure (20 s)
Gluma Etch 20 Gel:285018
Bond: 010080
Clearfil SE Bond (CLF)
(Kuraray, Kurashiki, Japan)
Primer: 10-MDP, HEMA, hydrophilic dimethacrylate, camphorquinone, N,N-Diethanol-p-toluidine, water
Bond: 10-MDP, Bis-GMA, HEMA, hydrophobic dimethacrylate, camphorquinone, N,N-diethanol-p-toluidine
Primer: apply and leave (20 s), gently air dry
Bond: apply, gently air dry, light cure (10 s)
Primer: 00852B
Bond: 01250B
Abbreviations: Bis-GMA = bisphenol A glycidyl dimethacrylate; UDMA = urethane dimethacrylate; Bis-EMA = bisphenol A ethoxy dimethacrylate; HEMA = 2-hydroxyethyl methacrylate; GPDM = glycerolphosphate dimethacrylate; PAMM = phthalic acid monoethyl methacrylate; GDMA = glycerol dimethacrylate; 4-META = 4-methacryloyloxyethyl trimellit anhydride; MDP = 10-methacryloyloxydecyl dihydrogen phosphate
Table 1: Chemical composition, application protocol and batch numbers of materials used in the study.