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Andrew A. O. Tay | OMICS International
ISSN: 2090-4541

Journal of Fundamentals of Renewable Energy and Applications
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Andrew A. O. Tay

 Professor  Department of Mechanical Engineering,  National University of Singapore Singapore

Biography

Dr Andrew Tay is a Professor in the Department of Mechanical Engineering, National University of Singapore, Singapore. He obtained his B.E. in Mechanical Engineering with First Class Honours and University Medal from the University of New South Wales, Australia, and subsequently his PhD in Mechanical Engineering from the same university. His research interests include thermomechanical failure of IC packages, delamination and cracking of IC packages, effects of moisture on plastic IC package reliability, wafer level packaging, solder joint reliability, cooling of electronic components and equipment, wire bonding, wire sweep. He is currently affiliated to both Department of Mechanical Engineering  and Solar Energy Research Institute of Singapore at National University of Singapore, Singapore.  He is a member of the Editorial Board of Microelectronics Journal as well as a member of the Advisory Committee of the Centre for IC Failure Analysis and Reliability, National University of Singapore. He was an Associate Editor of the ASME Journal of Electronic Packaging and a member of the Editorial Board of the international journal Finite Elements in Design and Analysis. He was the General Chairman of the First and the Second IEEE Electronic Packaging Technology Conference (EPTC’97 and EPTC’98), Singapore. He was also an international liaison for the ASME InterPack and the IEEE ITHERM series of international conferences on electronics packaging. In May 2000, Prof Tay was awarded an IEEE Third Millennium Medal by the IEEE Society of Components, Packaging and Manufacturing Technology for outstanding contributions to the Society.

Research Interest

Thermomechanical failure of IC packages, delamination and cracking of IC packages, effects of moisture on plastic IC package reliability, wafer level packaging, solder joint reliability, cooling of electronic components and equipment, wire bonding, wire sweep

 

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