Effect of Lanthanum Doping on the Microstructure Evolution and Intermetallic Compound (IMC) Growth during Thermal Aging of SAC305 Solder Alloy
- *Corresponding Author:
- Tabassum Yasmin
University of Engineering & Technology Peshawar, Pakistan
Tel: +92 91 9216796
E-mail: [email protected]
Received Date: June 23, 2014; Accepted Date: October 07, 2014; Published Date: October 13, 2014
Citation: Yasmin T, Sadiq M, Khan MI (2014) Effect of Lanthanum Doping on the Microstructure Evolution and Intermetallic Compound (IMC) Growth during Thermal Aging of SAC305 Solder Alloy. J Material Sci Eng 3:141. doi: 10.4172/2169-0022.1000141
Copyright: © 2014 Yasmin T, et al. This is an open-access article distributed under the terms of the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited.
Sn96.5Ag3Cu0.5 (SAC305) is widely used as lead-free solder for surface mount technology (SMT) card assembly and for ball-grid-array (BGA) interconnection in the microelectronic packaging industry as solder balls and pastes. In this study the effects of Lanthanum (La) doping on SAC305 under thermal aging was investigated as function of intermetallic compounds (IMCs) growth and grain size evolution. The morphology of the microstructure was analyzed under Scanning Electron Microscope (SEM) and optical microscope, the elemental distribution was confirmed by Energy Dispersive Spectroscopy (EDS) and phase identification of the crystalline structure formed during thermal aging was confirmed by x-ray diffraction (XRD). It was found that the microstructure of SAC305 solder alloy changes significantly with addition of La. Quantitative analysis of grain size and intermetallic particle size was performed both for undoped and La-doped SAC305 alloys.