alexa Room Temperature Gas Sensing with Ultrathin Au Nanowire
ISSN: 2169-0022

Journal of Material Sciences & Engineering
Open Access

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Review Article

Room Temperature Gas Sensing with Ultrathin Au Nanowires

Lal N*

School of Chemistry, University of Leeds, Leeds LS2 9JT, UK

*Corresponding Author:
Lal N
School of Chemistry, University of Leeds
Leeds LS2 9JT, UK
Tel: 07405740277
E-mail: [email protected]

Received Date: March 08, 2016; Accepted Date: March 15, 2016; Published Date: March 25, 2016

Citation: Lal N (2016) Room Temperature Gas Sensing with Ultrathin Au Nanowires. J Material Sci Eng 5: 241. doi:10.4172/2169-0022.1000241

Copyright: © 2016 Lal N. This is an open-access article distributed under the terms of the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited.

 

Abstract

One-dimensional nanostructures are of particular interest in nanoelectronics because of the ease with which they can be utilized in fabricating nanodevices where their long axis facilitates contact to the structure, while the short axis preserves the quantized nature of electronic levels. It is therefore desirable to synthesize precisely controlled semiconductor and metal nanowires to study their properties. With much advancement achieved in producing high quality and appreciably controlled semiconductor nanowires, approaches to precisely control the dimensions of metal nanowires still needs to be explored. Here, we have investigated room-temperature sensing properties of these gold nanowires for hydrogen, ethanol and NH3. The sensitivity and selectivity of the wires for sensing different gases are explored. The sensing devices were fabricated by drop-casting the nanowire dispersion over pre-patterned electrodes ultimately paving the path for cost effective applications of these nanowires. Simple chemical routes and solution processing techniques has been utilized for their subsequent device applications. The driving force behind the solution processed devices is their low cost, large device area, physical flexibility and compatibility with the existing technologies.

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