alexa Two-Step Leaching of Valuable Metals from Discarded Pri
ISSN: 2475-7675

Advances in Recycling & Waste Management
Open Access

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Research Article

Two-Step Leaching of Valuable Metals from Discarded Printed Circuit Boards, and Process Optimization Using Response Surface Methodology

Arda Işıldar1,2*, Eldon R Rene1, Eric D van Hullebusch1,2 and Piet N L Lens1,3

1Department of Environmental Engineering and Water Technology, UNESCO-IHE Institute for Water Education, Post Box 3015, 2601 DA Delft, The Netherlands

2Laboratory Geomaterials and Environment (LGE), University Paris-Est, EA 4508, UPEM, 77454 Marne Valley, France

3Department of Chemistry and Bioengineering, Tampere University of Technology, PO Box 10 541, Tampere, Finland

*Corresponding Author:
Işıldar A
Department of Environmental Engineering and Water
Technology, UNESCO-IHE Institute for Water Education
PO Box 3015, 2601 DA Delft, The Netherlands
Tel:
+31(0)152151715
E-mail:
[email protected]

Received date: May 12, 2017; Accepted date: May 20, 2017; Published date: May 26, 2017

Citation: Isildar A, Rene ER, Hullebusch EDV, Lens PNL (2017) Two-Step Leaching of Valuable Metals from Discarded Printed Circuit Boards, and Process Optimization Using Response Surface Methodology. Adv Recycling Waste Manag 2: 132. doi:10.4172/2475-7675.1000132

Copyright: © 2017 Işıldar A, et al. This is an open-access article distributed under the terms of the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited.

 

Abstract

Waste electrical and electronic equipment (WEEE) is an important secondary source of valuable metals. Particularly discarded printed circuit boards (PCB) contain high concentrations of valuable metals, varying greatly among the type of board, the manufacture year, source device, and utilized PCB production technology. Chemical hydrometallurgical processing is an efficient method to selectively extract and subsequently recover metals from discarded polymetallic PCB. In this work, we propose a two-step process to extract copper (Cu) and gold (Au) from a discarded high-grade telecom server PCB. The boards contained 262.4 and 0.320 mg/g Cu and Au, respectively, which constituted the 98.1% of the total value of metals. The metal extraction process was optimized using Response Surface Methodology (RSM) by central composite design (CCD). The optimized process parameters showed that 3.92 M sulphuric acid, 3.93 M Hydrogen peroxide, 6.98% (w/v) pulp density and 3.7 hours contact time, and 0.038 M Copper sulphate, 0.3 M 0.38 M Ammonium Hydroxide, 10.76% pulp density (w/v) 6.73 hours were optimal for the maximal extraction of Cu and Au, respectively. At optimal conditions, 99.2% and 92.2% of Cu and Au, respectively, were extracted from the discarded PCB.

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