alexa Block Copolymer Based Bottom-up Nanolithography: Materials, Processes, And Applications | 14711
ISSN: 2157-7439

Journal of Nanomedicine & Nanotechnology
Open Access

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3rd International Conference on Nanotek & Expo

Dipu Borah
Accepted Abstracts: J Nanomed Nanotechnol
DOI: 10.4172/2157-7439.S1.015
Abstract
The future of circuit miniaturization is based on the development of novel functional materials and the improvement of nanofabrication and characterization techniques. The performance of semiconductor electronics is coupled to the resolution of the lithographic process; and to keep pace with historic growth rates (e.g., Moore's Law), the dimensions of critical circuit elements are shrinking toward 10 nm. The development of micro- and nano- technology depends on the ability to fabricate micro and nanosized structures with high precision. The most sophisticated semiconductor devices, such as microprocessors and memory chips, are patterned with top-down projection lithographic techniques. In parallel, the bottom-up approach is based on hierarchical self-assembly of complex structures departing from molecular building blocks through molecular recognition and molecule-surface interactions. There are advantages and drawbacks in both approaches. In top-down methodologies further downsizing is critically related to issues both with light particle dimensions and also thermal management. On the other hand, it is highly challenging to achieve long-range translational order and robustness of the fabricated systems with bottom-up approaches. Block‐copolymers (BCPs) are promising materials in the field that successfully compromises top‐down and bottom‐ up methodologies. BCP materials to control feature ordering, orientation, alignment and defect density besides the formation of ?on-chip? resist from the BCP nanopatterns by plasma etch and transferring the pattern into the substrate will be discussed. The demonstrated results are promising and pertinent in the nanotechnology field and with vast applicability such as in the fabrication of nanoimprint lithography stamps, nanosensors, nanofluidic devices or in narrow and multilevel interconnected lines
Biography
Dipu Borah has completed his Ph.D. from Dibrugarh University, India in 2005. He was a postdoctoral research fellow at Seikei University, Tokyo under Indo-Japan Cultural Exchange Program from 2006-2007. Currently, he is a senior postdoctoral researcher at University College Cork, Ireland. His current research interests are in the block copolymer self-assembly, self-assembled monolayer, graphoepitaxy, nanopatterning, electrochemical sensor, etc. He has published more than 35 papers in reputed journals
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