Himanshu Ranjan Verma
Indian Institute of Technology (Banaras Hindu University), India
Himanshu Ranjan Verma has his expertise in electronic/metallurgical waste recycling. He started his technical career by joining BTech in Mechanical Engg. After Graduation, he worked as Lecturer in a reputed engineering college and due to his inclination towards metallurgy he changed his domain of expertise to metallurgical Engg., during higher studies. He earned gold medal during his MTech (Metallurgical Engineering) from Indian Institute of Technology (BHU), Varanasi in 2013 and, immediately he has joined PhD at the same university. In-between, He worked in National Metallurgical Laboratory, Jamshedpur India, for 1 year as a Trainee pursuing research on rare-earth metal recycling. During his short research career of 3-4 years, he published 05 papers in high impact factor journals. He also participated in more than 12 conferences; secured awards like best poster, best presentation etc.
A new technique of waste printed circuit boards (WPCBs) recycling by dissolution of brominated epoxy resin (BER) in dimethyl formamide (DMF) has been investigated. Dissolution of BER is highly influenced by parameters like temperature, size, WPCB: DMF etc. and it results separation of layers of WPCBs. WPCBs of 1cm2, 2cm2 and 3cm2 were separated into components after 120 min, 180 min and 240 min respectively at 408 K and 300 g/l. DMF after usage was recycled and analyzed by gas chromatography, proton and carbon nuclear magnetic resonance spectroscopy. Residue obtained after recycling of DMF was analyzed by Fourier-transforms infra-red spectroscopy and scanning electron microscope-energy dispersive X-ray. Investigation of mechanism of dissolution revealed that H-bonding plays a very important role. This technique featuring separation of different components, regeneration of DMF, recovery of BER makes the process extremely cost effective, negligible effluent generating and thus, resulting cleaner processing of WPCBs.