Pankaj Kumar Shrivastava

Pankaj Kumar Shrivastava

AKS University, Satna

Title: Modeling And Single Objective Optimization Of WEDM Process Using AI Tools


Dr. Pankaj Kumar Shrivastava born at Satna, Madhya Pradesh, India. He earned his Master Degree in Production Engineering from Indian Institute of Technology Delhi, New Delhi and PhD from Motilal Nehru National Institute of Technology, Allahabad, Uttar Pradesh, India. His several research papers on various topics are published on incredible, frequently referred International and National Journals and Conference Proceedings. He has a vast experience in the field of variety of industries including defense and cement manufacturing. Apart from this he has a significant experience of about 09 years in the field of academics serving at various Institutes in India. Presently he is working as Associate Professor in Mechanical Engineering Department, AKS University, Satna, Madhya Pradesh. His area of interest is electrical discharge machining, nonconventional machining processes, design of experiment applications in manufacturing processes and applications of artificial intelligence in advanced machining processes.


Understanding and solving the complexity of the manufacturing processes have always been a challenge for researchers. The tools of artificial intelligence are now boon to predict and solve the complex manufacturing behavior. In the present research, the wire electrical discharge machining (WEDM) has been performed on copper-iron-graphite metal matrix composite. Experiments have been performed in CNC wire cut electrical discharge machine. The obtained experimental results have been used to develop the artificial neural network model for two of the important output characteristics; material removal rate (MRR) and surface roughness (Ra). The models have found to be very accurate to predict the output characteristics. Further, genetic algorithm has been used to find the optimum values of MRR and Ra. Considerable improvement has been found in both the MRR and Ra after optimization.