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Page 94

April 16-17, 2018 Las Vegas, Nevada, USA

2

nd

Edition of

Graphene & Semiconductors | Diamond Graphite & Carbon Materials Conference

6

th

Edition of

Smart Materials & Structures Conference

&

Journal of Material Sciences and Engineering| ISSN: 2169-0022 | GDCSM-2018 | Volume: 7

Cutting and extruding processing technology for ceramics based on edge-chipping effect

Long Wang

Academy of Armored Forces Engineering, China

E

dge-chipping referred to the fact that the edges of hard, brittle materials are easily broken during processing. This problem has

brought many difficulties to their quality control. In fact, it was that the machining process itself destroyed materials, even though

it could be controlled. Based on this principle, a new machining technology based on crack propagation driven by edge-chipping

effect was proposed here. Multiple flanges caused by the cutting could increase the number of edges. Additionally, the fracture defects

were prefabricated on the surface of flanges. When the turning tool made of cemented carbide came into contact with the surface

of the ceramics, under the intermittent impact. The fractures were generated on the sides of flanges contacted with the tool and the

prefabricated micro cracks were expanded rapidly under this three-dimensional stress field applied externally by the tool. In addition,

due to the stress release toward the free surface, the cracks would expand to the surfaces of newly generated edges and the chips would

be broken off continuously, resulting in irregular edge-chipping and removal of material pieces. Furthermore, based on the spatial

distribution of grayscale images, the surface quality after rough processing under the different conditions was reasonably reflected

with the grayscale co-occurrence matrix (GLCM). With the new processing technology, these cracks became advantageous under

specific conditions. Therefore, the high external energy and ultra-hard tools required for the traditional processing technologies

could be significantly reduced, and the ceramics could be removed with less energy consumption and the tools with the hardness of

lower than its own one. Therefore, it not only could reduce the processing costs, but also could promote the extensive applications of

engineering ceramic materials.

waloxs@163.com

J Material Sci Eng 2018, Volume: 7

DOI: 10.4172/2169-0022-C3-098