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ISSN ONLINE(2319-8753)PRINT(2347-6710)

International Journal of Innovative Research in Science, Engineering and Technology
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Special Issue Article

Effect of Processing Temperature and Holding Time on Interface Bonding Of Al/Sic: Finite Element Method

S.Deepak1, M.Thulasidass1, R.Kirubanandham1, G.G.Sozhamannan2
  1. Student, Mechanical Department, Sri Manakula Vinayagar Engineering College, Madagadipet, Pondicherry, India
  2. Assoc. Professor, Mechanical Department, Sri Manakula Vinayagar Engineering College, Madagadipet, Pondicherry,Tamilnadu, India
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Abstract

The main aim of this analysis is to study the effect of bonding strength between metal and ceramic at different processing temperature and holding time. The Al/SiC bonding was modelled and analyzed using finite element analysis in ANSYS software. The different values of coefficients of linear thermal expansion (CTEs) of the metal and ceramic are induces more thermal stress at the interface. The mismatch of thermal stress at the interface region plays an important role in improving bonding strength. Hence, it is essential to study and evaluate the interface bonding in metal-ceramics joints.

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