alexa Abstract | Study of Some Mechanical Properties and Wetting Behavior with Addition Bi to SnCu Solder Alloys
ISSN ONLINE(2319-8753)PRINT(2347-6710)

International Journal of Innovative Research in Science, Engineering and Technology
Open Access

Like us on: https://twitter.com/ijirset_r
OMICS International organises 3000+ Global Conferenceseries Events every year across USA, Europe & Asia with support from 1000 more scientific Societies and Publishes 700+ Open Access Journals which contains over 50000 eminent personalities, reputed scientists as editorial board members.

Open Access Journals gaining more Readers and Citations

700 Journals and 15,000,000 Readers Each Journal is getting 25,000+ Readers

This Readership is 10 times more when compared to other Subscription Journals (Source: Google Analytics)

Research Article Open Access

Abstract

Composition of Sn99.5-xCu0.5Bix has been examined as one of the lead free solder alloys and considered for soldering in electronic packaging. The addition of bismuth to Tin improves the ductility and restrains the fillet lifting, which are problems of lead-free solders with Bi. Melting point of the samples were studied; the addition of Bismuth to SnCu0.5 binary alloy lowers the melting temperature. Wetting contact angle measurements of the Sn99.5 Cu0.5, Sn59.5 Cu0.5Bi40, Sn54.5 Cu0.5Bi45 and Sn49.5 Cu0.5Bi50 rapidly solidified lead free solder alloys on CuZn30 substrate were carried out at 573 K. The internal friction, elastic moduli, microhardness and the microstructure of the as-cast alloys at room temperature have been investigated. The examined physical properties are improved by increasing bismuth contents in the studied lead free solder alloys. These improved properties indicate that these alloys are adequate for low temperature soldering applications

To read the full article Peer-reviewed Article PDF image | Peer-reviewed Full Article image

Author(s): S. Mohammed , A.El-Maghraby

Share This Page

Additional Info

Loading
Loading Please wait..
 
 
Peer Reviewed Journals
 
Make the best use of Scientific Research and information from our 700 + peer reviewed, Open Access Journals
International Conferences 2017-18
 
Meet Inspiring Speakers and Experts at our 3000+ Global Annual Meetings

Contact Us

 
© 2008-2017 OMICS International - Open Access Publisher. Best viewed in Mozilla Firefox | Google Chrome | Above IE 7.0 version
adwords