alexa Diffusion bonding of Ti3AlC2 ceramic via a Si interlayer

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Diffusion bonding of Ti3AlC2 ceramic via a Si interlayer

Based on the structure characteristic of Ti3AlC2 and the easy formation of Ti3Al1 − x Si x C2 solid solution, a Si interlayer was selected to join Ti3AlC2 layered ceramic by diffusion bonding method. Joining was performed at 1,300–1,400 °C for 120 min under 5 MPa load in an Ar atmosphere. The phase composition and interface microstructure of the joints were investigated by XRD, SEM and EPMA.

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