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The Influence that the Blend Process has on the Hardening Behavior of a PU/Epoxy Resin System
Anisotropic conductivefilms (ACFs) are composed of resin, conductive particles, and release films. Employed for their thinning ability, simple manufacturing procedure, environmentally-friendly lead-free production process, absence of α-particles, and favorable damp-proof, adhesive, conductive, and insulating functions, ACFs are mainly used to bond two substrates and circuits. Furthermore, ACFs are conductive vertically (Z axis) and insulative horizontally (X and Y axes). When the difference between the on-state resistance along the Z axis and the insulation resistance of the XY plane exceeds a certain degree, excellent anisotropic conductivity is attained. The conductive principle refers to the use of conductive particles to connect electrodes of the integrated circuit (IC) chip and the liquid crystal display (LCD) substrate, where only the current is allowed to travel along the Z axis and short circuits are prevented from occurring at neighboring electrodes.
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