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With the continued reduction of dimensions of technological devices, the heat produced can be important, component failures can occur. According to NASA, 90% of failures are due to defects and thermal interconnects, according to the US Air Force, 55% of electronic failures are due to thermal effects. The heat transfer control in these systems is a major challenge of miniaturization. Further reducing the size of the systems causes the decreased ability of materials to distribute heat when the scales are of the order of a nanometer or micrometer sometimes due to the spatial confinement effect in the nanostructures. Therefore, measurement of thermal parameters of thin films and heat transfer modeling in these systems are important from the theoretical point of view to understand the physical mechanisms underlying and from the point of view of the application to improve the design.
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