alexa Application Of FeCl3 And Fe(OH)3 Compounds For Comprehensive Silica Removal Facilitating Zero Liquid Discharge In RO And IC Waste Water Reuse
ISSN: 2469-9764

Industrial Chemistry
Open Access

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2nd World Conference on Industrial Chemistry and Water Treatment
May 22-23, 2017 Las Vegas, USA

Ehren D Baca, Jr L Lin and Kerry J Howe
University of New Mexico, USA
Chung Yuan Christian University, China
Posters & Accepted Abstracts: Ind Chem
DOI: 10.4172/2469-9764-C1-006
Abstract
Chemical mechanical planarization (CMP), used heavily in integrated circuit (IC) manufacture, generates copious amounts of waste water high in colloidal and reactive silica, which inhibits on-site reuse in cooling operations and ultra-pure water (UPW) production. Silica, when present in cooling water, can reach solubility limits via evaporation and form impervious scale on heat transfer surfaces that decreases efficiency. Silica in reverse osmosis feed-water inhibits aspirations for high rejection and zero liquid discharge (ZLD) due to scale formation. When subjected to RO at high rejection, silica forms difficult-toremove scale on the membrane concentrate side in the form of glassy patches and communities of aggregate particles. Current methods for silica scale mitigation in industry include dosing with chemical anti scalents or complex operating schemes including ion exchange and large pH swings. This work evaluates the implementation of the common chemical coagulant, FeCl3 and highly insoluble Fe (OH)3 in the removal of silica by coagulation and adsorption mechanisms, respectively. FeCl3 was shown to be optimizable for silica colloid coagulation in CMP waste water via charge neutralization resulting in turbidity <10NTU. Adsorption of reactive silica on Fe (OH)3 using a sequencing batch reactor approach exhibited >90% silica removal for the first adsorption cycle, and increased utilization of adsorbent material for subsequent runs in both CMP waste water and RO concentrate.
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