Wai Ming Cheung | OMICS International
ISSN: 2167-0846

Journal of Pain & Relief
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Wai Ming Cheung

Faculty of Education, The University of Hong Kong, Hong Kong 


Wai Ming Cheung is currently working as an eminent Faculty member at Faculty of Education, The University of Hong Kong, Hong Kong. He has published numerous research papers and articles in reputed journals and has various other achievements in the related studies. He has extended his/her valuable service towards the scientific community with his extensive research work. 

Research Interest

Neuropathic pain, Spondylotic, Disc herniation, Medications, Spinal cord injury, Pharmacological interventions, Compressive myelopathy.